Intimation of Conference call scheduled to be held on Monday, May 11, 2026, to discuss Q4FY26 audited financial results of the Company
MOLDTKPAC · price
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Mold-Tek Packaging Limited has scheduled an investor conference call on May 11, 2026 at 4:30 PM IST to discuss Q4 and FY26 audited financial results. The call will be hosted by Emkay Global Financial Services with Chairman and Managing Director J Lakshmana Rao participating. The company filed this intimation under SEBI LODR Regulations, 2015, with both BSE (Scrip Code: 533080) and NSE (Symbol: MOLDTKPAC). This is a routine earnings disclosure event where retail and institutional investors can participate via dial-in numbers provided. The company is headquartered in Hyderabad with registered office at Jubilee Hills.
This is a standard investor relations activity and does not signal any unusual corporate development. Investors interested in the company's Q4 and full-year FY26 performance can participate in the call to gain insights directly from management.