Mold-Tek Packaging Limited has informed the Exchange about Schedule of meet
MOLDTKPAC · price
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Mold-Tek Packaging Limited has informed the exchanges that its officials will attend an investor conference organized by Nirmal Bang Institutional Equities on June 25, 2025, from 5:00 PM to 6:00 PM IST. The meeting will be held virtually in a 1x1 or group format. The company has clarified that only publicly available information will be discussed and no unpublished price-sensitive information (UPSI) will be shared. The schedule is subject to change depending on organizer or company requirements.
This is a routine disclosure about an upcoming investor interaction and is unlikely to have a direct impact on the stock price. It reflects normal investor relations activity and signals continued engagement with institutional investors.