Mold-Tek Technologies Limited has informed the Exchange about Link of Recording
MOLDTECH · price
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Mold-Tek Technologies has shared the audio recording of a conference call held on June 17, 2025, with investors. The call discussed key business updates related to two recently signed Memorandums of Understanding (MoUs) — one with Interarch Building Solutions Limited (IBSL) and another with Affordable Robotic & Automation Limited (ARAPL). The audio recording has been uploaded to the company's investor relations page on its website. This is a routine disclosure under SEBI's listing regulations, submitted to both BSE and NSE.
Gives shareholders access to management's commentary on the new partnerships with IBSL and ARAPL. Investors should listen to the recording for details on the strategic intent and potential business opportunities from these MoUs, which could influence the stock's outlook.