Announced Wed, 29 Jul · 18:48 IST
SPEL Semiconductor signs tripartite MoU with Calsoft and Natronix for chip and AI work
Price
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+0.5%1-day move
₹153.70
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₹153.00
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AI summary
SPEL Semiconductor board approved a strategic tripartite MoU with California Software Company (Calsoft) and Natronix-India on July 29, 2026. The partnership targets research, development, design, and IP creation for semiconductor chips and AI solutions. SPEL will handle assembly, test, mark, and package operations, while Natronix-India will lead semiconductor IC design and design IP. The board authorized the Head Operations to finalize and execute the agreement.
Likely market impact
Strategic entry into semiconductor and AI design space through partnerships could strengthen growth and tech capabilities, positive for long-term prospects.