Board meeting on Aug 26 to consider bonus shares, dividend and AGM

Corporate Actions View source PDF Explain this filing

MOLDTKPAC · price

Loading chart…

▲ positive · ▼ negative · ● neutral filings · teal = economic event · numbered = multiple that day (click to pick). Times IST.

Price reactionminutes from the announcement price · days from the prior close

+4.0%Reaction day

₹679.55

prior close

₹681.40

announcement price

In-mkt

timing

Nifty Microcap 250market · in no size index; the smallest one is used+0.3%+3.8% vs market

Packaging peers, median of 64sector+0.0%+4.0% vs sector

On the reaction day the stock moved 3.8 pts more than Nifty Microcap 250 and 4.0 pts more than its Packaging peers, over the same two closes: a difference in percentage points, not a measure of what the filing did.

Minutes after the announcementfrom the announcement price · no benchmark

Stock

+3.0

10m

+2.6

15m

+2.4

30m

+1.7

Sessions after the filingfrom the prior close

StockMarketvs marketSectorvs sector

Reaction day

+4.0+0.3+3.8+0.0+4.0

Next day

+5.4+0.5+4.9-0.2+5.5

+3.8+0.1+3.7+0.4+3.4

+4.6+0.7+3.9-0.5+5.1

+3.2+0.4+2.7-0.3+3.5

+1.8+0.7+1.0-0.3+2.1

+3.0+0.1+2.9-0.9+3.8

15d

-1.0+1.5-2.5-1.4+0.3

-5.2+0.3-5.4-2.5-2.7

-56.0-6.2-49.8-6.3-49.8

—————

UpDownMarket · Nifty Microcap 250Sector · Packaging peers, median of 64Pending

Minute windows have no benchmark: there is no intraday index history to compare against.

AI summary

Mold-Tek Packaging's board will meet on August 26, 2026 to consider issuing fully paid bonus equity shares to existing shareholders, increase authorized share capital (subject to shareholder approval), recommend a final dividend for FY26 if any, and set the record date and 29th AGM details. Bonus ratio and dividend amount are not yet disclosed.

Likely market impact

Bonus and dividend consideration are typically positive for shareholders. Watch for ratio and dividend details after the meeting.